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IEEE International Workshop on
Memory Technology, Design, and Testing (MTDT 2006)

August 2-4, 2006

Grand Formosa Regent Taipei
Taipei, Taiwan

http://larc.ee.nthu.edu.tw/~mtdt06/index.htm

CALL FOR PAPERS


- Submission Deadline Extended to 5 April, 2006 -

Objective -- Scope -- Submissions -- Important Dates -- About Taiwan and Taipei -- Further Information -- Committees

Objective

Following the traditions set up by its predecessors, MTDT06 will provide a forum dedicated to the recent advancements of the memory technology, covering topics such as memory device, circuit design, architecture, fabrication process, verification, yield analysis testing/diagnosis/repair for all kinds of memory such as SRAM, DRAM, Flash memory, EPROM, EEPROM, embedded memories, 3-D memories, content addressable memories, etc.

Scope

Original contributions related to memory design and test technology are solicited. Topics of interest include, but are not limited to, the following categories:

  • Next-generation memory device
  • Memory testing
  • Next-generation memory process
  • Memory built-in self-test
  • DRAM cell design
  • Memory diagnosis & repair
  • Flash cell design
  • Cell Characterization
  • Cache memory design
  • Failure analysis
  • Multi-port SRAM design
  • Fault modeling
  • High-speed memory design
  • Yield analysis
  • Low-power memory design
  • Reliability analysis
  • Fault-tolerant architecture
  • Memory for space application
  • Memory compiler
  • Verification methodology

Submissions

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Submission should be made electronically at the workshop web site, i.e., http://larc.ee.nthu.edu.tw/~mtdt06. A submission should contain a complete manuscript of less than 5000 words with an abstract of less than 200 words. A submission will be considered as evidence that once accepted the author(s) will prepare the final manuscript in time for being included in the proceedings and will present the paper at the workshop. Papers accepted will be published in a formal proceeding.

Important Dates

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  • Submission deadline: April 5, 2006 (extended)
  • Notification of acceptance: April 25, 2006
  • Deadline for final manuscript: May 15, 2006

About Taiwan and Taipei

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Taiwan is an island of 36,000 square kilometers, 70% of which are covered by spectacular mountains. With a population of about 23 million, Taiwan is one of the world's major IC design and manufacturing centers. Taipei, a modern city of more than 3 million people, is located in the northern part of Taiwan, and the capital of Taiwan.

Further Information

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Email: mtdt06@larc.ee.nthu.edu.tw

URL: http://larc.ee.nthu.edu.tw/~mtdt06

Committees

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Steering Committee

Rochit Rajsuman, Advantest, USA
Thomas Wik, Deep-µ Silicon Solution, USA
Robert Evans, MOSAID, USA

Organizing Committee

General Co-Chairs
Rochit Rajsuman, Advantest, USA
Cheng-Wen Wu, National Tsing-Hua U., Taiwan

Program Chair
Shi-Yu Huang, National Tsing-Hua U., Taiwan

Finance Chair
Chih-Tsun Huang, National Tsing-Hua U., Taiwan

Local Arrangements Chair
Ya-Chin King, National Tsing-Hua U., Taiwan

Publications Chair
Jin-Fu Li, National Central U., Taiwan

Registration Chair
Shyue-Kung Lu, Fu-Len Catholic U., Taiwan

Program Committee

Robert Aitken, Artisan, USA
Robert Aitken, Artisan, USA
Roger Barth, Intel, USA
Wu-Tung Cheng, Mentor Graphics, USA
Bruce Cockburn, U. of Alberta, Canada
Travis Cho, Powerchip Semi. Corp., Taiwan
Shine Chung, TSMC, Taiwan
Christophe Frey, ST Microelectronics, France
Jan Van Houdt, IMEC, Belgium
Andre Ivanov, U. of British Columbia, Canada
Ding-Ming Kwai, IP Library Inc., Taiwan
Chung Lam, IBM, USA
Fabrizio Lombardi, Northeastern U., USA
Chih-Yuan Lu, Macronix, Taiwan
Martin Margala, U. of Rochester, USA
Erik Jan Marinissen, Philips, Netherlands
Sharon Murray, Medtronic Micro, USA
Paolo Prinetto, Politecnico di Torino, Italy
Joe Ting, Etron Tech. Inc., Taiwan
Star Sung, Imaging Tek, Taiwan
Joerg Vollrath, Infineon Tech. Inc., German
Vyacheslav Yarmolik, BSUIR, Belarus
Yervant Zorian, Virage Logic, USA

For more information, visit us on the web at: http://larc.ee.nthu.edu.tw/~mtdt06/index.htm

The IEEE International Workshop on Memory Technology, Design, and Testing (MTDT 2006) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC), the Technical Committee on VLSI, and the National Tsing-Hua University, Taiwan in cooperation with the National Science Council, Taiwan, and the Ministry of Education, Taiwan.


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
André IVANOV
University of British Columbia- Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

SENIOR PAST CHAIR
Yervant ZORIAN
Virage Logic- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com


TTTC 2ND VICE CHAIR
Michel RENOVELL
LIRMM- France
Tel. +33 467 418 523
E-mail renovell@lirmm.fr

FINANCE CHAIR
Adit D. SINGH
Auburn University- USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

IEEE DESIGN & TEST EIC
Rajesh K. GUPTA
University of California, Irvine- USA
Tel. +1-949-824-8052
E-mail gupta@uci.edu

TECHNICAL MEETINGS
Cheng-Wen WU

National Tsing Hua Univ.- Taiwan
Tel. +886-3-573-1154
E-mail cww@computer.org

TECHNICAL ACTIVITIES
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica- Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

ASIA & SOUTH PACIFIC
Hideo FUJIWARA
Nara Inst. of Science and Technology- Japan
Tel. +81-74-372-5220
E-mail fujiwara@is.aist-nara.ac.jp

LATIN AMERICA
Marcelo LUBASZEWSKI
Federal Univ. of Rio Grande do Sul (UFRGS)- Brazil
Tel. +34-93-401-6603
E-mail luba@vortex.ufrgs.br

NORTH AMERICA
William R. MANN
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Adit D. SINGH
Auburn University- USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic, Inc.- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

 

PAST CHAIR
Paolo PRINETTO
Politecnico di Torino- Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 1ST VICE CHAIR
Adit D. SINGH
Auburn University- USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

SECRETARY
Christian LANDRAULT
LIRMM- France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Rob AITKEN
Artisan Components- USA
Tel. +1-408-548-3297
E-mail aitken@artisan.com

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic, Inc.- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

Univ. of Piraeus- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys- USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Joan FIGUERAS
Univ. Politècnica de Catalunya- Spain
Tel. +55-51-228-1633, Ext. 4830
E-mail figueras@eel.upc.es

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut- Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
Michael NICOLAIDIS
iRoC Technologies- Greece
Tel. +33-4-381-20763
E-mail michael.nicolaidis@iroctech.com

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino- Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it


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